HP GRAPHICS PROBLEM SOLVED

HP Pavilion DV Series, TX Series, etc. / Compaq Presario C Series, F series.

CALL 01494416333

We have been researching into BGA reballing for the last 6 months, due to the un-acceptable amount of warranty returns.

The only way to resolve GPU chip problem is to reball the chips themselves. Many repair centers
reflow the chip, as we use to. This is a temporary repair.

The reason behind the failure itself justify the success of Reballing.

Thermal cycling causes the following in Lead-Free Solder over time.

Weak bonds
Solder Voids
Organic Matter Build Up
Cracking Brittle Joints
"Black pad" caused by the formation of brittle intermetallic layers
Pad Cratoring, Itis the space left vacant when a BGA ball pad lifts off the board.

All of these are caused by the solder going through so many thermal cycles due to the lack of
heat dispersion, simply put the solder spheres are too old.

Therefore it must be replaced, also to reduce the damage each thermal cycle causes we have
fabricated a heat sink modification to reduce the run heat of the GPU by 40%.

WE ARE SO CONFIDENT THAT REBALLING WILL REPAIR THE GPU PROBLEM WE ARE OFFERING A COLLECT
AND RETURN WARRANTY ON ALL LAPTOPS WE REBALL THE GPU CHIP.